Manual Do Utilizadoríndice analítico1 Introduction71.1 Terminology81.2 Reference Documents92 Product Specifications112.1 Package Description112.1.1 Non-Grid Array Package Ball Placement112.2 Package Loading Specifications122.3 Thermal Specifications132.4 Thermal Design Power (TDP)132.4.1 Methodology142.4.1.1 Pre-Silicon142.4.1.2 Post-Silicon142.4.2 Application Power142.4.3 Specifications143 Thermal Metrology153.1 Case Temperature Measurements153.1.1 Thermocouple Attach Methodology153.2 Airflow Characterization164 Reference Thermal Solution194.1 Operating Environment194.1.1 ATX Form Factor Operating Environment194.1.2 Balanced Technology Extended (BTX) Form Factor Operating Environment204.2 Mechanical Design Envelope214.3 Thermal Solution Assembly214.4 Environmental Reliability Requirements24Tamanho: 700 KBPáginas: 39Language: EnglishAbrir o manual