사용자 설명서차례1 Introduction71.1 Document Goals and Scope71.1.1 Importance of Thermal Management71.1.2 Document Goals71.1.3 Document Scope81.2 Reference Documents91.3 Definition of Terms93 Thermal Metrology273.1 Characterizing Cooling Performance Requirements273.1.1 Example293.2 Local Ambient Temperature Measurement Guidelines303.3 Processor Power Measurement Metrology Recommendation323.3.1 Sample Preparation334 System Thermal/Mechanical Design Information374.1 Overview of the Reference Design374.1.1 Altitude374.1.2 Heatsink Thermal Validation374.2 Environmental Reliability Testing384.2.1 Structural Reliability Testing384.2.1.1 Random Vibration Test Procedure384.2.1.2 Shock Test Procedure384.2.2 Power Cycling404.2.3 Recommended BIOS/CPU/Memory Test Procedures404.3 Material and Recycling Requirements404.4 Safety Requirements414.5 Reference Attach Mechanism414.5.1 Structural Design Strategy414.5.2 Mechanical Interface to the Reference Attach Mechanism412 Processor Thermal/Mechanical Information112.1 Mechanical Requirements112.1.1 Processor Package112.1.2 Heatsink Attach162.1.2.1 General Guidelines162.1.2.2 Heatsink Clip Load Requirement162.1.2.3 Heatsink Attach Mechanism Design Considerations172.2 Thermal Requirements182.2.1 Processor Junction Temperature192.3 Heatsink Design Considerations192.3.1 Heatsink Size202.3.2 Heatsink Mass212.3.3 Thermal Interface Material212.4 System Thermal Solution Considerations222.4.1 Chassis Thermal Design Capabilities222.4.2 Improving Chassis Thermal Performance222.4.3 Summary25크기: 1.32메가바이트페이지: 53Language: English매뉴얼 열기