User ManualTable of ContentsIntroduction7Definition of Terms7Reference Documents8Packaging Technology9Package Mechanical Requirements10Thermal Specifications11Thermal Design Power (TDP)11Die Case Temperature Specifications11Thermal Simulation13Thermal Metrology15Die Case Temperature Measurements155.1.1 Zero Degree Angle Attach Methodology15Reference Thermal Solution17Operating Environment17Heatsink Performance17Mechanical Design Envelope18Board-Level Components Keepout Dimensions18Torsional Clip Heatsink Thermal Solution Assembly186.5.1 Heatsink Orientation206.5.2 Extruded Heatsink Profiles206.5.3 Mechanical Interface Material206.5.4 Thermal Interface Material216.5.5 Heatsink Clip216.5.6 Clip Retention Anchors22Reliability Guidelines22Thermal Solution Component Suppliers23Torsional Clip Heatsink Thermal Solution23Mechanical Drawings252-1. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Top View)92-2. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Side View)92-3. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Bottom View)105-1. Zero Degree Angle Attach Heatsink Modifications165-2. Zero Degree Angle Attach Methodology (Top View)16Chipset Component186-3. Torsional Clip Heatsink Board Component Keepout196-4. Retention Mechanism Component Keepout Zones196-5. Torsional Clip Heatsink Assembly206-6 Heatsink Rails to PXH Package Footprint206-7. Torsional Clip Heatsink Extrusion Profile21B-1. Torsional Clip Heatsink Assembly Drawing26B-2. Torsional Clip Heatsink Drawing27B-3.Torsional Clip Drawing283-1. Intel® 6700PXH 64-bit PCI Hub Thermal Specifications116-1. Chomerics* T710 TIM Performance as a Function of Attach Pressure216-2. Reliability Guidelines22B-1. Mechanical Drawing List25Size: 605 KBPages: 28Language: EnglishOpen manual