User ManualTable of Contents1 Introduction71.1 Design Flow7Figure 1-1. Thermal Design Process81.2 Definition of Terms81.3 Reference Documents92 Packaging Technology11Figure 2-1. MCH Package Dimensions (Top View)11Figure 2-2. MCH Package Dimensions (Side View)11Figure 2-3. MCH Package Dimensions (Bottom View)122.1 Package Mechanical Requirements123 Thermal Specifications133.1 Thermal Design Power (TDP)133.2 Case Temperature13Table 3-1. Intel® 5000P Chipset MCH Thermal Specifications13Table 3-2. Intel® 5000V Chipset MCH Thermal Specifications13Table 3-3. Intel® 5000X Chipset MCH Thermal Specifications144 Thermal Simulation155 Thermal Metrology175.1 MCH Case Temperature Measurement175.1.1 Supporting Test Equipment17Table 5-1. Thermocouple Attach Support Equipment (Sheet 1 of 2)175.1.2 Thermal Calibration and Controls185.1.3 IHS Groove18Figure 5-1. IHS Groove Dimensions19Figure 5-2. Orientation of Thermocouple Groove Relative to Package Pin195.1.4 Thermocouple Conditioning and Preparation19Figure 5-3. Bending the Tip of the Thermocouple205.1.5 Thermocouple Attachment to the IHS20Figure 5-4. Securing Thermocouple Wires with Kanton* Tape Prior to Attach21Figure 5-5. Thermocouple Bead Placement21Figure 5-6. Position Bead on the Groove Step22Figure 5-7. Using 3D Micromanipulator to Secure Bead Location22Figure 5-8. Measuring Resistance between Thermocouple and IHS22Figure 5-9. Applying the Adhesive on the Thermocouple Bead235.1.6 Curing Process235.1.7 Thermocouple Wire Management24Figure 5-10. Thermocouple Wire Management Groove24Figure 5-11. Removing Excess Adhesive from the IHS24Figure 5-12. Filling the Groove with Adhesive245.1.8 Power Simulation Software256 Reference Thermal Solution276.1 Operating Environment276.2 Heatsink Performance27Figure 6-1. Tall Torsional Clip Heatsink Measured Thermal Performance Versus Approach Velocity276.3 Mechanical Design Envelope28Figure 6-2. Tall Torsional Clip Heatsink Volumetric Envelope for the Chipset MCH286.4 Board-Level Components Keepout Dimensions286.5 Tall Torsional Clip Heatsink Thermal Solution Assembly29Figure 6-3. Tall Torsional Clip Heatsink Board Component Keepout29Figure 6-4. Retention Mechanism Component Keepout Zones306.5.1 Heatsink Orientation30Figure 6-5. Tall Torsional Clip Heatsink Assembly306.5.2 Extruded Heatsink Profiles316.5.3 Mechanical Interface Material316.5.4 Thermal Interface Material316.5.4.1 Effect of Pressure on TIM Performance31Table 6-1. Honeywell PCM45 F TIM Performance as a Function of Attach Pressure316.5.5 Heatsink Clip31Figure 6-6. Tall Torsional Clip Heatsink Extrusion Profile326.5.6 Clip Retention Anchors326.6 Reliability Guidelines32Table 6-2. Reliability Guidelines (Sheet 1 of 2)327 Reference Thermal Solution 2357.1 Operating Environment357.2 Heatsink Performance35Figure 7-1. Short Torsional Clip Heatsink Measured Thermal Performance Versus Approach Velocity357.3 Mechanical Design Envelope36Figure 7-2. Short Torsional Clip Heatsink Volumetric Envelope for the Chipset MCH367.4 Board-Level Components Keepout Dimensions367.5 Short Torsional Clip Heatsink Thermal Solution Assembly37Figure 7-3. Short Torsional Clip Heatsink Board Component Keepout37Figure 7-4. Retention Mechanism Component Keepout Zones387.5.1 Heatsink Orientation38Figure 7-5. Short Torsional Clip Heatsink Assembly387.5.2 Extruded Heatsink Profiles397.5.3 Mechanical Interface Material397.5.4 Thermal Interface Material397.5.4.1 Effect of Pressure on TIM Performance397.5.4.2 Heatsink Clip39Figure 7-6. Torsional Clip Heatsink Extrusion Profile397.5.5 Clip Retention Anchors397.6 Reliability Guidelines39A Thermal Solution Component Suppliers41A.1 Tall Torsional Clip Heatsink Thermal Solution41A.2 Short Torsional Clip Heatsink Thermal Solution42B Mechanical Drawings43Size: 3.1 MBPages: 52Language: EnglishOpen manual