User Manual (44R5630)Table of Contents1 Introduction91.1 Objective91.2 Scope91.3 References91.4 Definition of Terms102 Thermal/Mechanical Reference Design132.1 Mechanical Requirements132.1.1 Processor Mechanical Parameters132.1.2 Quad-Core Intel® Xeon® Processor 5400 Series Package142.1.3 Quad-Core Intel® Xeon® Processor 5400 Series Considerations182.2 Processor Thermal Parameters and Features192.2.1 Thermal Control Circuit and TDP192.2.2 Digital Thermal Sensor202.2.3 Platform Environmental Control Interface (PECI)212.2.4 Multiple Core Special Considerations212.2.5 Thermal Profile242.2.6 TCONTROL Definition252.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5400 Series262.2.8 Performance Targets282.3 Fan Fail Guidelines322.4 Characterizing Cooling Solution Performance Requirements332.4.1 Fan Speed Control332.4.2 Processor Thermal Characterization Parameter Relationships342.4.3 Chassis Thermal Design Considerations362.5 Thermal/Mechanical Reference Design Considerations372.5.1 Heatsink Solutions372.5.2 Thermal Interface Material382.5.3 Summary382.5.4 Assembly Overview of the Intel Reference Thermal Mechanical Design392.5.5 Thermal Solution Performance Characteristics412.5.6 Thermal Profile Adherence422.5.7 Components Overview452.5.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile49A 1U Alternative Heatsink Thermal/Mechanical Design53A.1 Component Overview53A.2 Thermal Solution Performance Characterics54A.3 Thermal Profile Adherence54B Mechanical Drawings57C Heatsink Clip Load Methodology83C.1 Overview83C.2 Test Preparation83C.2.1 Heatsink Preparation83C.2.2 Typical Test Equipment86C.2.3 Test Procedure Examples86C.2.4 Time-Zero, Room Temperature Preload Measurement86C.2.5 Preload Degradation under Bake Conditions87D Safety Requirements89E Quality and Reliability Requirements91E.1 Intel Verification Criteria for the Reference Designs91E.1.1 Reference Heatsink Thermal Verification91E.1.2 Environmental Reliability Testing91E.1.3 Material and Recycling Requirements93F Enabled Suppliers Information95F.1 Supplier Information95F.1.1 Intel Enabled Suppliers95F.1.2 Additional Suppliers96Size: 3.15 MBPages: 100Language: EnglishOpen manual