Gosuncn Technology Group Co. Ltd. GM500U1A User Manuals

Table of Contents

• 1. Product Overview

  11
• 1.1. General Description

  11
• 1.3. Function Diagram

  12
• 1.4. Evaluation Board

  13
• 2. Application Interface

  14
• 2.1. General Description

  14
• 2.4.1. Power Supply Pins

  22
• 2.4.2. Decrease Voltage Drop

  22
• 2.4.3. Reference Circuit of Power Supply

  22
• 2.5. Turn on Scenarios

  23
• 2.6. Turn off Scenarios

  25
• 2.8. USIM Card Interface

  28
• 2.8.1. Description of PINs

  28
• 2.8.2. Design Considerations for USIM Card Holder

  29
• 2.10. UART Interface

  33
• 2.10.1. UART CONNECTION

  34
• 2.10.2. UART LEVEL MATCH

  35
• 2.10.3. Use ic for level switch

  40
• 2.11. Network Status Indication

  41
• 2.12. POWER_ON/OFF Status Indicator ON_STATE

  42
• 2.14. WAKEUP_IN Signal

  43
• 2.15. WAKEUP_OUT Signal

  44
• 3. Antenna Interface

  47
• 3.2. Reference Design

  47
• 3.3. Reference PCB Layout of Antenna

  49
• 3.4. Suggestions for EMC & ESD Design

  49
• 3.4.1. EMC Design Requirements

  49
• 3.4.2. ESD Design Requirements

  49
• 3.5. Test Methods for Whole-Set Antenna OTA

  50
• 4. Electrical, Reliability and Radio Characteristics

  51
• 4.1. Absolute Maximum Ratings

  51
• 4.2. Operating Temperature

  51
• 4.3. Electrostatic Discharge

  51
• 4.4. GM500_U1A Test

  51
• 4.4.1. Current Consumption

  51
• 4.4.2. RF Output Power

  52
• 4.4.3. RF Receiving Sensitivity

  52
• 4.5. GNSS Technical Parameters

  52
• 5. Mechanical Dimensions

  53
• 5.1. Mechanical Dimensions of the Module

  53
• 5.2. Footprint of Recommendation

  55
• 6. Related Test & Test Standard

  56
• 6.1. Testing Reference

  56
• 6.2. Description of Testing Environment

  56
• 6.3. Reliability Testing Environment

  57
• 7. SMT Process and Baking Guide

  58
• 7.1. Storage Requirements

  58
• 7.2. Module Plainness Standard

  58
• 7.3. Process Routing Selection

  58
• 7.3.1. Solder Paste Selection

  58
• 7.3.2. Design of module PAD’s steel mesh opening on main board

  58
• 7.3.3. Module Board’s SMT process

  59
• 7.3.4. Module Soldering Reflow Curve

  60
• 7.3.5. Reflow method

  61
• 7.3.6. Maintenance of defects

  61
• 7.4. Module’s Baking Requirements

  61
• 7.4.1. Module’s Baking Environment

  61
• 7.4.2. Baking device and operation procedure

  62
• 7.4.3. Module Baking Conditions

  62
• 8. Federal Communication Commission Interference Statement

  62
• Table 1-1 GM500_U1A Supported Band

  11
• Table 1-2 GM500_U1A Key Features

  11
• Table 2-1 IO Parameters Definition

  16
• Table 2-2 Logic levels Description

  16
• Table 2-3 Pin Description

  16
• Table 2-4 Power Supply

  22
• Table 2-5 Definition of POWER_ON

  24
• Table 2-6 Power-on Time

  25
• Table 2-7 Power-off Time

  25
• Table 2-8 Pin Definition of the USIM Interface

  28
• Table 2-9 Pin Description of Molex USIM Card Holder

  30
• Table 2-10 Pin Description of Amphenol USIM Card Holder

  31
• Table 2-11 USB Pin Description

  32
• Table 2-12 Pin Definition of the Main UART Interface

  33
• Table 2-13 Pin Definition of the Debug UART Interface

  34
• Table 2-14 Pin Definition of Network Indicator

  42
• Table 2-15 Working State of the Network Indicator

  42
• Table 2-16 Pin Definition of ON_STATE

  42
• Table 2-17 Pin Definition of the ADC

  43
• Table 2-18 Characteristic of the ADC

  43
• Table 2-19 Pin Definition of WAKEUP_IN

  43
• Table 2-20 Pin Definition of WAKEUP_OUT

  45
• Table 2-21 Pin Definition of GPIO

  46
• Table 3-1 Pin Definition of Antenna

  47
• Table 4-1 Absolute Maximum Ratings

  51
• Table 4-2 Operating Temperature

  51
• Table 4-3 ESD characteristic

  51
• Table 4-4 Averaged standby DC power consumption [1]

  51
• Table 4-5 Averaged working current [1]

  51
• Table 4-6 Averaged working current [2]

  52
• Table 4-7 Conducted RF Output Power

  52
• Table 4-8 Conducted RF Receiving Sensitivity Typical Value [1]

  52
• Table 4-9 Conducted RF Receiving Sensitivity Typical Value [2]

  52
• Table 4-10 GNSS Technical Parameters

  52
• Table 6-1 Testing Standard

  56
• Table 6-2 Testing Environment

  56
• Table 6-3 Testing Instrument & Device

  57
• Table 6-4 Reliability Features

  57
• Table 7-1 Baking parameters

  58
• Table 7-2 LCC module PAD’s steel mesh opening

  58
• System Connection Structure

  13
• Figure 2–1 Pin Assignment

  16
• The input reference circuit of VBAT

  22
• Reference circuit of DC-DC

  23
• Reference circuit of LDO

  23
• Reference circuit of POWER_ON

  24
• Timing of Turning on Mode

  25
• Timing of Turning off Mode

  26
• reference circuit to reset module

  27
• Timing of Reset Mode

  27
• Figure 2–10 Reference Circuit of the 8 Pin USIM Card

  29
• Figure 2–11 Reference Circuit of the 6 Pin USIM Card

  29
• Figure 2–12 Molex 91228 USIM Card Holder

  30
• Figure 2–13 Amphenol C707 10M006 512 2 USIM Card Holder

  31
• Figure 2–14 Reference Circuit of USB Application

  32
• Figure 2–15 Reference Circuit of USB Communication between module and AP

  32
• Figure 2–16 Reference circuit of USB when USB is not the desired function

  33
• Figure 2–17 Schematic of 8-wire UART Connection

  34
• Figure 2–18 Schematic of 3-wire UART Connection

  34
• Figure 2–19 Schematic of 4-wire UART Connection

  35
• Figure 2–20 Recommended TXD circuit

  36
• Figure 2–21 Recommended RXD circuit

  37
• Figure 2–22 Recommended RTS circuit

  38
• Figure 2–23 Recommended CTS circuit

  39
• Figure 2–24 Recommended 8-wires UART level switch circuit

  40
• Figure 2–25 Recommended 4-wires UART level switch circuit

  41
• Figure 2–26 Recommended 2-wires UART level switch circuit

  41
• Figure 2–27 The test point of debug UART

  41
• Figure 2–28 Reference Circuit of the Network Indicator

  42
• Figure 2–29 WAKEUP_IN input sequence

  44
• Figure 2–30 Connections of the WAKEUP_IN pin

  44
• Figure 2–31 The output signal of WAKEUP_OUT

  45
• Figure 2–32 Connections of the WAKEUP_OUT pin

  45
• Reference Circuit of Antenna Interface

  48
• Reference Circuit of GNSS Antenna

  48
• The OTA test system of CTIA

  50
• GM500_U1A Top and Side Dimensions

  53
• GM500_U1A Bottom Dimensions

  54
• Recommended Footprint

  55
• Figure 7–1 Module Board’s Steel Mesh Diagram

  59
• Figure 7–2 Material Module Pallet

  59
• Tape Reel Dimension

  60
• Figure 7–4 Module Furnace Temperature Curve Reference Diagram

  61