Intel SC5250-E User Manual
System Peripheral Bays
Intel® Entry Server Chassis SC5250-E
Revision
1.02
Intel order number C32881-001
28
5.10.1
SCSI HSBP Board Layout
The following diagram shows the layout of components and connectors on the hot-swap SCSI
backplane printed circuit board set. This solution consists of two separate boards. The first
board provides power distribution and SCSI interfacing of the drives. The second board
provides the SAF-TE features and drive failure indicators.
backplane printed circuit board set. This solution consists of two separate boards. The first
board provides power distribution and SCSI interfacing of the drives. The second board
provides the SAF-TE features and drive failure indicators.
Figure 27. Server Chassis SC5250-E SCSI Backplane
5.10.2
SCSI Hot-Swap Backplane Specifications
The server chassis SC5250-E hot-swap SCSI backplane is an embedded application
subsystem that does the following during normal operation:
subsystem that does the following during normal operation:
•
Responds to SAF-TE messages transmitted to the backplane via the SCSI bus.
•
Monitors the temperature on the backplane, and reports a warning or critical error if
outside programmed limits (if the server baseboard has a BMC-based management
system).
outside programmed limits (if the server baseboard has a BMC-based management
system).
•
Monitors the speed of the fans, if present, and reports a warning or critical error if
outside programmed limits (if the server baseboard has a BMC-based management
system).
outside programmed limits (if the server baseboard has a BMC-based management
system).