Intel 200 User Manual

Page of 53
 
Thermal Metrology 
 
 
Thermal and Mechanical Design Guidelines 
 29 
Figure 10  illustrates the combination of the different thermal characterization 
parameters. 
Figure 10.  Processor Thermal Characterization Parameter Relationships  
     
 
 
 
3.1.1 
Example 
The cooling performance, Ψ
JA,
 is then defined using the principle of thermal 
characterization parameter described above: 
•  The junction temperature 
TJ-MAX
 and thermal design power TDP given in the 
processor datasheet. 
•  Define the allowable heatsink temperature for processor, T
S-TOP-MAX
.   
The following provides an illustration of how one might determine the appropriate not 
related to any specific Intel processor thermal specifications, and are for illustrative 
purposes only.  
Assume the TDP, as listed in the datasheet, is 20 W and the maximum junction 
temperature 20 W is 90 °C.  Assume as well that the system airflow has been 
designed such that the local ambient temperature is 42 °C, and Ψ
HS_BASE 
= 0.3 °C/W. 
Then the following could be calculated using Equation 2: 
Ψ
JA
 = (T
J
 – T
A
) / TDP = (90 – 55) / 20 = 1.75 °C/W  
T
S-TOP
 
TIM
 
T
Ψ
JS
 
Ψ
HS BASE
 
Ψ
S-TOP-A
 
T