Intel 200 User Manual

Thermal and Mechanical Design Guidelines 

 11 

The Intel Celeron processor 200 sequence is available in a 479-pin Micro-FCBGA 

package, as shown in Figure 1 to Figure 3.  The processor uses a Flip-Chip Ball Grid 

Array (FC-BGA6) package technology that directly solder down to a 479-pin footprint 

on PCB surface.   

Mechanical specifications of the package are listed in Table 1.  Refer to the datasheet 

for detailed mechanical specifications.  In case of conflict, the package dimensions in 

the datasheet supersedes dimensions provided in this document. 

The processor package has mechanical load limits that are specified in the processor 

datasheet.  The specified maximum static and dynamic load limits should not be 

exceeded during their respective stress conditions.  These include heatsink 

installation, removal, mechanical stress testing, and standard shipping conditions.  

•  When a compressive static load is necessary to ensure thermal performance of the 

thermal interface material between the heatsink base and the processor die, it 

should not exceed the corresponding specification given in the processor 

datasheet.  

•  When a compressive static load is necessary to ensure mechanical performance, it 

should remain in the minimum/maximum range specified in the processor 

datasheet.  

No portion of the substrate should be used as a mechanical reference or load-bearing 

surface for the thermal or mechanical solution. 

The processor datasheet provides package handling guidelines in terms of maximum 

recommended shear, tensile and torque loads for the processor substrate.  These 

recommendations should be followed in particular for heatsink removal operations.